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MEMS

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X-FAB (www.xfab.com)

As the world's leading foundry group for analog/mixed-signal semiconductor applications X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support.

X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS processes in geometries ranging from 1.0μm to 130 nm, special SOI and MEMS long-lifetime processes. With our six manufacturing sites in Germany, France, Malaysia and the USA, we have a combined capacity of about 100,000 eight inch equivalent wafer starts per month.

 

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Philips Innovation Services

(www.innovationservices.philips.com)

We offer services in prototyping, process development and production in MEMS as well as in Micro Devices.

We operate a state-of-the-art 2650m2 pure-play MEMS Foundry on the High Tech Campus in Eindhoven, the Netherlands. Our MEMS Foundry is specialized in low to medium volume custom MEMS manufacturing of 4, 6, 8 inch and even square substrates. We offer the flexibility to use substrate materials like silicon, SOI, GaAs, glass, quartz and CMOS-wafers. We work with ISO13485 and ISO9001 quality systems.

Our Micro Devices facility is fit for prototyping as well as volume production. Our services are industrial PCBA prototyping, assembly of high-end PCBAs, and interconnect architecture & prototyping.

MEMS Design Services

Representing MEMS design houses with capabilities of: MEMS mirrors, pressure sensors, RF switches, microphones, Piezo motors, gyroscopes, wafer level packaging (WLP), optical lens integration and more.

Please contact us for more information

IHP (www.ihp-microelectronics.com)

IHP is a research institute of the German Leibniz Association with strong competencies in SiGe BiCMOS, RF circuit design and wireless systems. It develops innovations for application areas such as wireless and broadband communication, health, security, aerospace, automotive and industrial automation.

IHP offers a Multi-project Wafer and Prototyping Service with high performance 0.25 and 0.13µm SiGe BiCMOS technologies in its 200mm pilot line. The technologies currently include HBTs up to 500 GHz fmax , integrated RF MEMS and in BiCMOS integrated photonic components.

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Optocap (www.optocap.com)

Optocap's turn-key packaging services enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments.

 

Our expertise in packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This provides customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain.

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