As the world's leading foundry group for analog/mixed-signal semiconductor applications X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support.
X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS processes in geometries ranging from 1.0μm to 130 nm, special SOI and MEMS long-lifetime processes. With our six manufacturing sites in Germany, France, Malaysia and the USA, we have a combined capacity of about 100,000 eight inch equivalent wafer starts per month.
IHP is a research institute of the German Leibniz Association with strong competencies in SiGe BiCMOS, RF circuit design and wireless systems. It develops innovations for application areas such as wireless and broadband communication, health, security, aerospace, automotive and industrial automation.
IHP offers a Multi-project Wafer and Prototyping Service with high performance 0.25 and 0.13µm SiGe BiCMOS technologies in its 200mm pilot line. The technologies currently include HBTs up to 500 GHz fmax , integrated RF MEMS and in BiCMOS integrated photonic components.
SystematIC develops analog and mixed-mode integrated circuits (ICs) and provides all design services related to this development. These services include feasibility examination, system/IC architecture investigation, design and simulation (IC design), physical design and verification (IC layout), foundry selection and communication.
Besides supporting the design phase SystematIC also assists in sample evaluation, testing, and application support. We contribute to innovation in integration by creative circuit design and provide solutions to facilitate innovative electronic product development.
Aptasic offers the whole supply chain related to the production of Integrated Circuits (ICs) and its field of expertise expanded to cover all aspects related to the manufacturing of good devices, namely:
consulting in Design for Test, Design for Manufacturing, Design for Assembly (DfX) domains
multi-site wafer probing at cold/room/hot temperature
prototyping of small series (using ProtoPack)
encapsulation in plastic and ceramic packages
package test at cold/room/hot temperature
screening and qualification procedures (according to JEDEC and MIL-883 standards)
tape and reel (T&R)
and many other specialized processing steps that can be applied on semiconductor industry
Our expertise in packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This provides customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain.